Kuala Lumpur, 17 October 2025 — nanoSkunkWorkX will be presenting its latest research at the upcoming IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS) 2025 conference in San Jose, California.
Our accepted paper, “Enhanced Electrical and Thermal Conductivity of Electrodeposited Graphene–Copper Thin Films for BEOL Integration,” highlights the breakthrough behind nSD-I wafers — a graphene–copper platform that improves both thermal and electrical conductivity under standard BEOL process conditions.
The work demonstrates how low-temperature electrodeposited graphene–copper films can double in-plane thermal conductivity and improve electrical performance, paving the way for more efficient and reliable advanced packaging architectures such as EMIB and CoWoS.
“We’ve shown that graphene can fundamentally reduce interface friction at the heart of semiconductor packaging — making energy and electron transfer faster, cooler, and more efficient,” said Dr. Amani Salim, CTO and co-founder of nanoSkunkWorkX.`
The full poster and results will be shared following the presentation at IEEE EPEPS 2025.